Nexa AI Server
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| Processor | Up to two 3rd generation Intel Xeon scalable processors with up to 24 cores each |
| Memory | 16 DDR4 DIMM slots support a maximum of 1 TB of RDIMMs and a rate of up to 2933 MT/s |
| Storage Controllers |
• Internal controller (RAID): PERC H345, PERC H355, HBA355i, PERC H745, PERC H755, S150 • Internal Boot: Internal dual SD module or BOSS-S2: HWRAID 2x M.2 SSD or USB • External PERC (RAID): PERC H840 • External HBA (non-RAID): HBA355e |
| Drive Bays |
Front tray: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD), up to 64 TB • Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) up to 61.4 TB |
| Power Supplies |
• 1100 W DC / -48–(-60) V • 800 W Platinum AC 100-240 VAC or 240 VDC HVDC with hot swap redundancy • 600 W Platinum AC 100-240 VAC or 240 VDC HVDC, hot swap redundant |
| Dimensions |
• Height – 42.8 mm (1.7 inches) • Width – 482 mm (18.97 inches) • Depth – 734.95 mm (28.92 inches) – without bezel; 748.79 mm (29.47 inches) – with bezel |
| Form Factor | 1U rack server |
| Embedded Management | iDRAC9, iDRAC Service Module, iDRAC Direct, Quick Sync 2 wireless module |
| Security |
• Cryptographically signed firmware, Secure Boot, Secure Erase, Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
| Ports |
• Front: 1 x Dedicated iDRAC Direct micro-USB, 1 x USB 3.0, 1 x VGA • Rear: 1 x USB 2.0, 1 x Serial, 1 x USB 3.0, 2 x RJ-45, 1 x VGA • Internal: 1 x USB 3.0 |
As a leading integrated IT solutions provider, we combine cutting edge in-house manufacturing, dedicated R&D facilities, and a robust global distribution network to deliver comprehensive end-to-end infrastructure services. With a team of over 300 highly skilled professionals, including more than 150 certified engineers holding top-tier certifications, we bring 15 years of proven expertise in designing, deploying, and maintaining mission-critical IT environments for enterprises worldwide. Our vertically integrated approach ensures seamless quality control from component sourcing to final implementation.
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